Modern electronic products require high performance and reliability as well as minimal power. This is accomplished by combining multiple sub-systems of an electronic product into one or more integrated circuits (IC) called a system on a chip (SoC). Minimizing power consumption and energy efficiency are critical design requirements for the Internet of Things (IoT) applications.
ANSYS simulation technology will support ARM in its continued development of cutting edge semiconductor IP and the ARM ecosystem partners design reliable and robust semiconductor chips. ANSYS Redhawk, ANSYS Totem and ANSYS PowerArtist simulation solutions will help with electrostatic discharge, electromigration, power modeling, analyzing and validating foundation IP building blocks, as well as central processing units and graphics processing unit cores.
“The demand for reliable, robust and power efficient designs increases in a smart connected world as many devices will have to operate in energy-constrained environments,” said Brent Dichter, vice president, engineering flows, ARM. “The SoC’s design is a key part of the energy-efficiency equation. Giving our semiconductor partners access to our IP through ANSYS’ simulation tools enables them to optimize their designs earlier and allow more time to be spent creating competitive products that smooth their delivery path.”
“The powerful combination of ARM’s IP development expertise with ANSYS simulation tools strengthens ARM’s ability to provide world-class energy-efficient IP for various vertical segments of IoT,” said Vic Kulkarni, vice president and general manager, ANSYS. “By utilizing ANSYS technology, ARM and its ecosystem partners can design smarter and faster chips for electronic devices more easily.”
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