Industry-leading companies are innovating the next generation of electronic devices for high-performance computing, mobile, automotive and the Internet of Things (IoT) quicker and more efficiently – thanks to ANSYS semiconductor simulation solutions.
As the premier international conference for design and automation of electronic systems, the Design Automation Conference (DAC) showcases the most current developments in designs, design tools, intellectual property (IP) libraries and foundry technology support in the electronic and chip technology industry.
Over 25 papers from leading ANSYS customers – more than any other year – will be featured as part of DAC’s Designer and IP Track, demonstrating the broad adoption of ANSYS semiconductor power integrity and reliability solutions for sign-off in the industry. Designer and IP Track gives industry leaders an opportunity to share accomplishments in multiple segments of semiconductor and electronic system design processes. ANSYS customers will highlight the methodologies and flows that address complex challenges as well as how engineers are leveraging ANSYS tools to innovate the next generation of electronic devices across the industry – from automotive and IoT applications to high-performance computing and mobile devices.
“Proper design planning and sign-off for power noise, electro-migration and ESD reliability are careful design considerations in our mixed-signal IP and product design process,” said Hai Lan, senior manager of SIPI at Rambus. “We look forward to the upcoming opportunity at DAC to share how Rambus is able to leverage ANSYS simulation and optimization solutions to ensure the integrity of our complex designs, making our IP more consumable.”
“We are excited to see an unprecedented number of design papers from our customers at the upcoming Design Automation Conference in June,” said John Lee, general manager at ANSYS. “This underscores the importance ANSYS simulation brings to the industry and the critical role it plays in the design process.”
“The Designer and IP Track has become a major component of the overall DAC Technical Program and we are pleased with the quality and the overall number of submissions received for DAC 2016,” said Chuck Alpert, general chair, 53rd DAC. “It is with support of companies like ANSYS, customers and users in the design community that this track keeps growing each year.”
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