Cadence will host meetings with leading systems and semiconductor companies and demonstrate its IoT solutions, Tensilica DSPs for audio, imaging/vision, and IoT and IP for USB Type-C™ subsystem and MIPI, at the Mobile World Congress 2016, Barcelona, Spain from February 22 to 25, 2016.

What will you see:

  • Dolby Audio™ Premium
  • Audio Weaver
  • Android
  • Sensor Fusion
  • Convolutional neural network (CNN)
  • Face detection
  • People detection
  • IP subsystem for USB Type-C and Power Delivery
  • MIPI DSI + DSC mobile display solution
  • MIPI SoundWire Internet of Things demo platform

More information about the company, its products and its services is available at