Cadence will host meetings with leading systems and semiconductor companies and demonstrate its IoT solutions, Tensilica DSPs for audio, imaging/vision, and IoT and IP for USB Type-C™ subsystem and MIPI, at the Mobile World Congress 2016, Barcelona, Spain from February 22 to 25, 2016.
What will you see:
Audio/Voice
- Dolby Audio™ Premium
- Audio Weaver
- Android
- Sensor Fusion
Imaging/Vision
- Convolutional neural network (CNN)
- Face detection
- People detection
IP
- IP subsystem for USB Type-C and Power Delivery
- MIPI DSI + DSC mobile display solution
- MIPI SoundWire Internet of Things demo platform
More information about the company, its products and its services is available at www.cadence.com.
