System-on-a-Chip (SoC), a cutting-edge semiconductor packaging technology, represents the integration of computer hardware and software components on a single chip. Continuous developments in microelectronics and electronics packaging technologies have brought SoC packaging to the mainstream over the last few years. A simple SoC is a connectivity chip combining digital and mixed signal circuitry, while a complex SoC includes on-chip integration of graphics and application processor units, among others. As the primary characteristic of SoC is its ability to integrate multiple functions and features onto a single chip, the SoC technology has been evolving rapidly from powering a simple feature phone to becoming the core of smartphones and tablets. The technology is also making in-roads into automotive, energy, and industrial electronics. Emerging applications that facilitate “Internet of Things (IoT)” is also lending traction to market growth.

Innovation remains crucial to survival in the market with ever-changing technology trends in the electronics sector creating challenges in power management, engineering of asynchronous systems and integration of semiconductor IP. Rapid explosion of mobile devices is a major catalyst for technology advancements in the SoC market. Given the rapidly growing demand for high-performance, intelligent new generation electronic devices, SoC designers are faced with the challenge of designing more robust SoCs with new microarchitecture. While transistor scaling continues to improve performance and IC costs, companies are now centering greater interest on optimizing power consumption. Product development now entails continuous innovation in transistor materials and design to support the functionality and rich features of today’s mobile devices. Evading the transition from 40nm geometries to 28nm, chip designers are now realigning efforts towards more complex process technologies to develop wafers below 22nm. The new process nodes involve greater complexity with concepts such as immersion lithography, High-K Metal Gate (HKMG) transistors, double patterning, 3d-FinFets, and EUV gradually entering the design flow.

As stated by the new market research report on System-on-a-Chip (SoC), Asia-Pacific represents the largest and the fastest growing regional market with a CAGR of 21.1% over the analysis period. Growth in the region is led by rising penetration of smartphones, tablets, laptops and ultrabooks, growing adoption of industrial automation, and increasing implementations in automotive electronics. Growing production of electronic devices in response to growing consumer demand is providing a major fillip to the semiconductor industry in the region. China currently represents one of the fastest growing markets for semiconductors including SoCs.

Major players covered in the report include Altera Corporation, Apple Inc., ARM Holdings Plc, Broadcom Corporation, Freescale Semiconductor Inc., GCT Semiconductor Inc., Infineon Technologies AG , Intel Corporation, LSI Corporation , Marvell Technology Group Ltd., Mentor Graphics Corporation , Microsemi SoC Products Group, NVIDIA Corporation, Palmchip Corporation, Panasonic Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co. Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments Inc., Toshiba America Electronics Components Inc., and Zilog Inc.

The research report titled “System-On-A-Chip (SoC): A Global Strategic Business Report” announced by Global Industry Analysts Inc., provides a comprehensive review of market trends, growth drivers, issues, and recent industry activity of major companies worldwide. The report provides market estimates and projections for major geographic markets including the United States, Canada, Japan, Europe (France, Germany, Italy, UK, Spain, Russia and Rest of Europe), Asia-Pacific (China, South Korea, Taiwan and Rest of Asia Pacific), and Rest of World. The report analyzes the SoC market by product types – Mixed Signal SoCs and Other SoCs.

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