Semtech Corporation announced its updated portfolio of circuit protection solutions suitable for protecting Internet of Things’ (IoT) gateways and end nodes from threats induced by electrostatic discharge (ESD) events. Semtech LoRa Technology is a widely adopted low-power, long-range solution for IoT that gives telecom companies, IoT application makers, and system integrators the feature set necessary to deploy low-cost, interoperable IoT networks, gateways, sensors, module products, and IoT services worldwide.
IoT technologies are rapidly proliferating as enterprises, consumers and government agencies begin to implement “smart” infrastructure into day-to-day processes. At the heart of this emerging trend is Semtech’s industry-leading LoRa® Technology.
Semtech’s LoRa wireless RF technology is enabling IoT gateways and end nodes for novel and compelling IoT applications and use cases. The LoRa-based gateways and end-nodes within this infrastructure typically operate in demanding industrial environments and are surrounded by a rich array of data ports and other interfaces that benefit from Semtech’s high-performance ESD protection platforms. Semtech’s RClamp protection platform provides best-in-class protection performance to safeguard these data interfaces from ESD and overvoltage threats. The RClamp platform features industry-leading low clamping voltage and ultra-low capacitance for safeguarding sensitive data transceivers while also maintaining robust signal integrity.
”Semtech’s protection solutions provide designers with tools to significantly enhance the robustness of IoT platforms,” said Rick Hansen, Sr. Director of Product Marketing for Semtech’s Protection Products Group. “Our industry-leading circuit protection devices are ideal solutions for providing protection to safeguard IoT gateways and end nodes.”
Key Features of the Circuit Protection Platform for LoRa Gateways and End Nodes
- Low capacitance for minimal signal attenuation
- Low clamping and operating voltages for optimum protection of the USB ASIC
- Low leakage current for minimal power consumption
- High ESD current capacity
- Small package size through the use of Semtech’s proprietary Z-Pak™ process