TSMC and MediaTek announced their commitment to a long-term partnership to continue developing innovative products for Internet of Things (IoT) and wearable products with TSMC’s industry-leading and most comprehensive ultra-low power (ULP) technology platform. In this platform, TSMC offers multiple processes to provide significant power reduction benefits for Internet of Things and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers.
In January, TSMC and MediaTek achieved their first product milestone on this platform by launching MediaTek’s MT2523 chipset for fitness smart watches. Built on TSMC’s 55nm ULP technology, MT2523 is the world’s first system-in-package (SiP) solution to offer GPS, dual-mode Bluetooth Low Energy, and a MIPI-supported high-resolution mobile screen.
“We are pleased to continue the success of MT2523 and collaborate with TSMC in developing market leading IoT/wearable products using ULP technologies,” said JC Hsu, MediaTek’s Corporate Vice President and General Manager of Internet of Things business unit.
“TSMC’s offerings of 55-nanometer ultra-low power (55ULP), 40ULP, 28HPC+, and 16FFC are ideally suited for a variety of smart and power-efficient applications in the Internet of Things and wearable device markets,” said Dr. BJ Woo, TSMC’s Vice President, Business Development. “Collaborating with MediaTek, an innovator with expertise in bringing the best solution to the end customers, drives the advancement of TSMC ULP technologies that can enable the best and most competitive IoT product solutions to the world.”
For more information about TSMC please visit www.tsmc.com.
