Virtium, the embedded industry’s trusted supplier of highly reliable infrastructure SSDs and industrial memory modules, today announced that the company’s Director of Marketing, Scott Phillips, will present a session entitled “Overcoming Capacity and I-Temp Challenges in IoT Storage Design” at the upcoming Real-Time and Embedded Computing Conference (RTECC), January 22 at the Santa Clara Convention Center in Santa Clara, California.  Attendees at Virtium’s session will learn important design considerations and facts that go beyond theoretical datasheet information to provide real data points enabling OEMs to make the right storage selection.  It will outline the specific affects that extended high temperatures have on SSDs and supply useful calculations OEMs can use as reference points regarding endurance and data retention characteristics of different types of NAND flash media.  Phillips’ session will take place from 5 to 5:45 p.m. in Hall A, Room 210.

“Embedded storage capacity requirements are increasing, which places pressure on storage budgets making less-expensive MLC SSDs a seemingly attractive alternative.  Adding I-temp requirements exacerbates existing MLC endurance and data retention issues that are further compounded by IoT system software connectivity needs,” said Scott Phillips, director of marketing at Virtium.  “My presentation will give embedded system OEMs valuable data that provides practical solutions to help them meet their extended temperature and high capacity design specification needs.”

About Virtium
Virtium manufactures memory and storage solutions for the world’s top industrial embedded OEMs. For 18 years, the company has designed, built and supported its products in the USA – fortified by a network of global locations. Virtium’s world-class technology and unsurpassed support provide a superior customer experience that continuously results in better industrial embedded products for an increasingly interconnected world.

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